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LTM4604
APPLICATIONS INFORMATION
Safety Considerations
The LTM4604 modules do not provide isolation from V IN to
V OUT . There is no internal fuse. If required, a slow blow fuse
with a rating twice the maximum input current needs to be
provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4604 makes the PCB board
layout very simple and easy. However, to optimize its electri-
? Do not put vias directly on the pads unless they are
capped.
? SW pads can be soldered to board to improve thermal
performance.
Figure 14 gives a good example of the recommended
layout. For easier PC board layout and assembly due
to increased spacing between land grid pads, please
refer to the LTM4604A.
cal and thermal performance, some layout considerations
are still necessary.
? Use large PCB copper areas for high current path,
including V IN , GND and V OUT . It helps to minimize the
PCB conduction loss and thermal stress.
GND
V OUT
C OUT
C OUT
C OUT
? Place high frequency ceramic input and output capacitors
next to the V IN , GND and V OUT pins to minimize high
frequency noise.
? Place a dedicated power ground layer underneath the
unit.
? To minimize the via conduction loss and reduce module
V IN
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SW
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thermal stress, use multiple vias for interconnection
between top layer and other power layers.
C IN
?
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GND
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4604 F14
Figure 14. Recommended PCB Layout
V IN
2.375V TO 5.5V
C IN
10μF
6.3V
X5R OR X7R
OPEN-DRAIN
PULL UP
V IN
PGOOD V OUT
LTM4604
COMP FB
C OUT
22μF 3
6.3V
V OUT
1.5V
4A
C SSEXT
0.01μF
RUN/SS TRACK
GND
R FB
5.69k
0.5%
X5R OR X7R
REFER TO
TABLE 4
4604 F15
Figure 15. Typical 2.375V to 5.5V Input, 1.5V at 4A Design
4604fa
15
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